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3 IN 1 eMMC eMCP Test Socket BGA153/169 BGA162/186 BGA221 Reader 11x10mm 11.5x13mm 12x16mm 12x18mm 14x18mm Flash Data Recovery - Android data recovery

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3 IN 1 eMMC eMCP Test Socket BGA153/169 BGA162/186 BGA221 Reader 11x10mm 11.5x13mm 12x16mm 12x18mm 14x18mm Flash Data Recovery

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3 IN 1 eMMC eMCP Test Socket BGA153/169 BGA162/186 BGA221 Reader 11x10mm 11.5x13mm 12x16mm 12x18mm 14x18mm Flash Data Recovery
  • 3 IN 1 eMMC eMCP Test Socket BGA153/169 BGA162/186 BGA221 Reader 11x10mm 11.5x13mm 12x16mm 12x18mm 14x18mm Flash Data Recovery
  • 3 IN 1 eMMC eMCP Test Socket BGA153/169 BGA162/186 BGA221 Reader 11x10mm 11.5x13mm 12x16mm 12x18mm 14x18mm Flash Data Recovery
  • 3 IN 1 eMMC eMCP Test Socket BGA153/169 BGA162/186 BGA221 Reader 11x10mm 11.5x13mm 12x16mm 12x18mm 14x18mm Flash Data Recovery
  • 3 IN 1 eMMC eMCP Test Socket BGA153/169 BGA162/186 BGA221 Reader 11x10mm 11.5x13mm 12x16mm 12x18mm 14x18mm Flash Data Recovery
  • 3 IN 1 eMMC eMCP Test Socket BGA153/169 BGA162/186 BGA221 Reader 11x10mm 11.5x13mm 12x16mm 12x18mm 14x18mm Flash Data Recovery
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3 IN 1 eMMC eMCP Test Socket BGA153/169 BGA162/186 BGA221 Reader 11x10mm 11.5x13mm 12x16mm 12x18mm 14x18mm Flash Data Recovery

3 IN 1 eMMC eMCP Test Socket BGA153/169 BGA162/186 BGA221 Reader 11x10mm 11.5x13mm 12x16mm 12x18mm 14x18mm Flash Data Recovery

  • Apply to IC size:

    11.5x13mm,12x16mm,12x18mm,14x18mm
  • Interface:

    USB
  • IC Pitch:

    0.5mm
  • Structure:

    Clamshell
  • Product description:

    Feature : * Apply to eMCP and eMMC of Sumsung, Sandis k, Toshiba, Hynix, Micron, MTK and Int...

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3 IN 1 eMMC eMCP Test Socket BGA153/169 BGA162/186 BGA221 Reader 11x10mm 11.5x13mm 12x16mm 12x18mm 14x18mm Flash Data Recovery

Feature :

* Apply to eMCP and eMMC of Sumsung, Sandis k, Toshiba, Hynix, Micron, MTK and Intel.

* Apply to BGA153 BGA169 BGA162 BGA186 BGA221.(just need to change the corresponding socket)

* Easy operation by just inserting the USB into PC.

* It provides a compact test solution for eMMC eMCP used in applications such as mobile, data recorder, the Internet of things, etc.

1) Test, debug, validation, and programming of eMMC eMCP device

2) Failure analysis / System and wafer test.

3) Package and Chip qualification.

4) Production prototype / Data recovery.

We provide a simple software which can chekc the capacity , read , write and verify , please send us an email if you need it .


Specification :

* Type : BGA153/169 BGA162/186 BGA221 test socket ( USB interface )

* Pin Count :

BGA153/169 test socket:30 pins

BGA162/186 test socket : 17 pins

BGA221 test socket : 36 pins

* Pin Pitch : 0.5mm

* Applicable IC Size : 11.5x13mm , 12x16mm , 12x18mm , 14x18mm

* Life Span : 25,000 times


More types sockets and adapters for eMMC , eMCP , SOP, SSOP, TSSOP, QFP, QFN, BGA, SOT, MSOP, DFN and customize design , for customized socket and more product detail , please feel free to contact us .


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Applicable borders limiter / frame as below :

4 pcs / lot 11.5x13mm/12x16mm/12x18mm/14x18mm


Single size 11.5x13mm 


Single size 12x16mm 


Single size 12x18mm 


Single size 14x18mm 



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Shenzhen HongYi Electronics Co., Ltd.  is a technology-intensive high-tech enterprise integrated with R&D, production and sales. 

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