Focusing on socket for 17 years
global investment
Analysis BGA256 high stable socket for IC design R&D test in Lab,research center and UFS series test
Analysis BGA256 high stable socket for IC design R&D test in Lab,research center and UFS series test
Characteristics of eMMC BGA256
Analysis BGA256 high stable socket are as below:
1. Apply to different sizes of eMMC chip of Samsung, Sandisk, Micron,SK hynix etc.
2. Good quality Pogo pins were chosen for stable contact.
3. Materials of Popo pins:
Barrel - phophated bronze
Planger - Beryllium copper
Spring - Piano wire
4. Easy use for different customized eMMC chip sizes by using suitable guide plate.
5. Special PCB adapter for soldering.
6. Simple and quick fixing.
7. Layout of the test socket can be customized.
8. Rating current: 0.5A.
KZT eMMC BGA 256 analysis test socket, fixture, fixing or soldering socket with soldering plate. Easy to use.
ANDK SOCKETS Partners: SAMSUNG, Hynix, Sandisk, Intel, ASUS, Foxconn, ZTE, Toshiba, Kingston, Lenovo, MSI, Qualcomm, HUAWEI, ACER, TCL, Flextronics, BYD, etc.
